Advanced Packaging & Test Conference
According to Dataquest, in 2001 IDMs only outsourced 28.7% of their packaging and testing needs, but by 2011 the percentage will reach 48.1%,that means packaging & testing business will have a very bright future, for worldwide packaging& testing market, and also for China market. What we should do? How could we get this opportunity? You may find the answers in CHIP China Series 2008-Advanced Packaging & Test Conference, This conference, organized by ACT International Media Group, to be held in June 27th in Shanghai Purple Mountain Hotel, will bridge the vendors and the technical professional, provides them with a platform for face-to-face discussion.

Suss MicroTec,Struers Ltd., Camfil Farr Trading (Shanghai) Co, Ltd., Olympus,IBM, Agape Package Manufacturing (Shanghai)      Ltd.,Carsem,Oerlikon,SMIC and Freescale have confirmed to support CHIP China Series 2008- Advanced Packaging & Test Conference,we also gladly know that audient registration began to exceed 200, these engineers are at the front of R&D, manufacturing centers in fabless house, wafer manufacturer,packaging house, and equipment&materials suppliers.

The group’s flagship publication SST-AP China will be the official publication to provide all the necessary resources and support. You are cordially invited to join us in this event. We welcome contributed articles and new products and technologies information.

Proposed Topics
1. Advanced packaging
　　- BGA/CSP/Flip Chip/WLP/Chip stack
　　- Cu low-k interconnecting in 3D-SIC
　　- 3D Packaging and Through Silicon Vias
　　- Wire bonded for chip stacking
　　- Chip Stacking Technology with Lead-free Soldering
　　- Chip-to-wafer and wafer-to-wafer Technology for 3D System Integration

2. Micro-interconnect for packaging
　　- Low radian wire bonding/ TAB/ flip chip soldering/reflow soldering
　　- Wire bonding/wire frame/solder bumping/tiny-pitch bonding

3. Packaging materials and processing
　　- Pb-free solder, underfill, adhesives, heating, dispending, coating, etc.

4. Packaging design and reliability
　　- Packaging design and simulation… testing, simulating and analyzing for packaging reliability
　　- The new developments and challenges of packaging and assembling
　　- PoP/SiP/SoC packaging & testing
　　- Packaging & testing equipment
　　- Packaging testing and socket design
　　- Defect inspection and analysis
　　- LCD, LED, MEMS packaging & testing

5. Packaging substrates and PCBs
Other topics are welcomed.