大会主持/ Chairman：王家楫-复旦大学材料科学系教授 /Mr.Wang Jiaji–Professor, Fudan University

时间 Time

公司 Company

演讲 Presentations

序号
Ref

8:00-9:00

9:00-9:15

Mr.Adonis Mak - Publisher, SST-AP China
麦协林先生 -《半导体科技》杂志社社长

开幕词
Opening Address

A1

9:15 -9:30

Mr.Wang Longxing – Vice Secretary, SICA
王龙兴先生 - 上海市集成电路行业协会副秘书长

欢迎词
Welcome Speech

A2

9:30-10:10

Suss MicroTec (Shanghai) Ltd.
Dr. L. Gong - General manager, China
苏斯贸易（上海）有限公司
龚里博士 - 中国区总经理

Litho and Bonding Challenges for 3D Packaging
3D 封装应用中光刻和键合工艺的挑战

A3

茶歇 Tea-Break

10:30-11:10

Struers (Shanghai) International Trading Co.,Ltd.
Mr. Alan Zhang - Microelectronics Application Specialist
司特尔（上海）国际贸易有限公司
张万昌先生 - 微电子产品应用工程师

Failure Analysis of Electronic and Microelectronic Components with Target System
利用 Target System 对电子和微电子器件进行失效分析

A4

11:10-11:50

Camfil Farr Trading (Shanghai) Co.,Ltd.
Mr. Edward Zhao - Business Development Manager - AMC 
康斐尔法贸易（上海）有限公司
赵峰先生 - 分子过滤业务发展经理

Coming up next: molecular contamination and yield
分子污染控制 - 关注良率的下一个焦点

A5

13:15-13:45

Agape Package Manufacturing (Shanghai) Ltd.
Mr. Stone Chen - Manufacturing Director
葵和精密电子（上海）有限公司
陈卫东先生 - 制造总监

Analogy IC Online Test
模拟集成电路生产测试中的几个问题

A6

13:45-14:15

Olympus (Beijing) Sales & Services Co.,Ltd.
Ms. Deng Gang - Technology Engineer
奥林巴斯（北京）销售服务有限公司上海分公司
邓纲小姐 - 技术工程师

Application of Olympus Optical 3D Metrology in Semiconductor
Olympus 三维形貌测量技术在半导体领域的应用

A7

14:15-14:45

SMIC Shanghai
Dr. Tsing Chow, Wang – Distinguished MTS
中芯国际(上海)集成电路制造有限公司
王津洲博士 – 杰出技术师

Enabling Technologies for System in a Package
系统封装的先验技术

A8

14:45-15:15

IBM Global Business Services China Co., Ltd.
Mr. Jeff C.W. Chiang - Senior I/T Specialist, IBM Greater
China Group
国际商业机器全球服务（中国）有限公司
蒋正晖先生 - 大中华地区资深咨询经理

Improve Backend Productivity by CIM

A9

茶歇 Tea-Break

15:30-17:30

晶芯论坛 /  CHIP China Forum
主持人 / Chairman
王龙兴 - 上海市集成电路行业协会副秘书长 /Mr. Wang Longxing – Vice Secretary, SICA
王家楫 - 复旦大学材料科学系教授 /Mr. Wang Jiaji – Professor, Fudan University

论坛议题 / Forum Topics
1、2008 年及更远的未来，世界封装市场的发展趋势
The Future Trends of the Worldwide Packaging & Testing Market
2、Flip Chip, MCP,SiP,3D,WLCSP,以及基板级封等新型封装形式的新进展以及由此引发的测试挑战？
New development of Flip Chip, MCP, SiP, 3D, WLCSP etc. and New Package Technologies Lead to New Testing Challenges
3、封装工艺的污染控制，（原材料、气体、 水、空气）目前对制程工艺的影响等
Contamination Control in Assembling Process (Raw Materials, Gas, Water, Air, etc.)
4、封测厂是如何保证芯片的品质和可靠性？
How to Ensure Quality and Reliability in Packaging & Testing Processes?
5、传统的 IDM 外包趋势与中国半导体封装产业的机遇？台湾地区开放更多封测厂来内地，对内地企业会带来哪些影响？
The Trend of IDM Outsource and Opportunities for China Semiconductor Packaging & Testing Companies. As More and More Taiwanese Companies are Allowed to Invest in Mainland China, What will be the Impact to the Local Packaging and Testing Companies?

参与论坛嘉宾 / Forum Panelist
大会讲师及特邀嘉宾出席 Conference Speakers and Invited VIP will attend
特邀嘉宾包括  / Invited VIP
嘉盛半导体（苏州）有限公司 / Carsem Semiconductor (Suzhou) Co.,Ltd.
·纪华祥先生 - 总监,中国区销售 / 客户服务 /Mr. WS Kee, Director of China Sales and Customer Service
·陈武伟先生 - 资深工程部经理 /Mr. BW Tan, Senior Engineering Manager

飞思卡尔半导体（中国）有限公司 / Freescale Semiconductor (China) Ltd.
·姚晋钟先生 - 中国经理，高级封装及系统集成部 /Mr. Jinzhong Yao, China Manager, Advanced Packaging & System Integration

17:30

抽奖  Lucky Draw