Ref 序号 |
Speaker & Company 演讲人及公司 |
Presentations 演讲题目 |
8:30– 9:00 |
登记Registration |
A1 |
SAN CHINA - Adonis Mak - Publisher
《半导体科技》杂志社社长 - 麦协林 |
Opening Address 欢迎词 |
A2 |
EV GROUP
Paul Kettner, Sales Director, Asia-Pacific
亚太地区销售总监 | Wafer-to-Wafer and Chip-to-Wafer Bonding for 3D Integration
应用于三维集成的晶圆对晶圆和晶片对晶圆键合
|
A3 |
Suss MicroTec (Shanghai) Ltd
Dr. L. Gong, General manager, China
苏斯贸易（上海）有限公司
龚里博士, 中国区总经理
|
Lithography tools for 3D packaging
用于3D封装的光刻设备 |
A4 |
Unovis Solutions
John P. Almiranez
Sr. Laboratory Process Engineer, Advanced Process Laboratory
优诺维思
John P. Almiranez,高级工艺工程师,先进工艺开发部门
|
SMT as an Alternative Die Attach Solution
芯片着装的可替代解决方案-表面贴装 |
午 餐 Lunch |
A5 |
Advantest (Suzhou)Co., Ltd. Shanghai Branch
Akira Hamajima - Test Application Consultant 爱德万测试(苏州)有限公司
浜岛明, 测试技术顾问 |
Next generation Open Architecture Test Solution
下一代开放式架构测试解决方案 |
A6 |
Intel Technology Development (Shanghai)
Michael Wang - Ph.D. Project manager
英特尔技术开发(上海)有限公司
汪晓辉博士, 项目经理闪存,
封装技术研发部 |
Building blocks for thin SCSP packaging
用于薄型堆叠芯片封装（SCSP）的结构单元 |
A7 |
IMEC Shanghai Office
Diane Qi, Business Development Manager
IMEC上海联络处
戚丹, 业务拓展经理 |
3D system integration and next generation flip chip technologies
三维系统集成及下一代倒装芯片封装技术 |
A8 |
Heraeus Material Technology Shanghai Ltd.
Mr. Thomas Krebs, Technical Manager
上海贺利氏工业技术材料有限公司
Mr. Thomas Krebs, 技术经理 |
Fine Pitch Solder Paste Technology for Substrate and
Wafer Bumping
应用于基板和晶圆凸点的超细间距锡膏技术 |
抽奖 Lucky Draw |
