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| Organizer: |
SST-AP CHINA
ACT INTERNATIONAL |
| Supporting: |
PENNWELL; The Confab; SolidState Technology magazine; |
| Organizations: |
Advanced Packaging magazine; SST/AP Taiwan magazine;
CleanRooms China magazine; CleanRooms China Conference;
CASPA, Foundries and Sponsoring companies |
| Date: |
Sept 19-20, 2005 |
| Venue: |
Shanghai International Conference Center (tentative) |
| Estimated size: |
300 attendee |
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The cyclical nature of the semiconductor industry has always been a concern. Currently, the industry appears to be on an upturn. Or is it? Signals are mixed. Should we be expecting another downturn in the worldwide market? If so, will it impact China's semiconductor industry? In the meantime, is China's semiconductor industry still growing? Consequently, how do managers respond in this uncertain market and manage their investments in China?
China's semiconductor industry has its own characteristics and its rapid growth has attracted a large number of world class enterprises: China has become an important part of the global strategy. The increasing number of new offices, fabs, R&D centers, speaks for itself. Nevertheless, China's semiconductor manufacturing technology still lags behind the world; therefore, how can the industry maintain healthy and consistence growth? Equally important, how can China's semiconductor manufacturing and IC design industries become more interactive to pull together large scale development efforts? These questions are, without a doubt, central to the industry and are to be the focus of the SST-AP China Conference. We would like to invite executives from industry, research and academia to join and discuss these major issues.
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Who should attend:
Experts in the field; CEOs and executives from institutes, EDA companies, and foundries; engineers; technology directors; IC design and IP service providers; assembly & test providers; consumer & communication products manufacturers; computer peripheral manufacturers; and venture capital companies. |
| Proposed Topicsㄩ |
- World semiconductor industry outlook * The development of China's semiconductor industry and its government policies * World IC assembly industry and potential in China * Consistence & healthy growth of the industry in China * IC assembly & IC design * How to face the downturn
- Advanced technologies * Wafer cleaning and single wafer cleaning * Testing * Automation, robotics, and wafer handling * Process control and advanced process control * Metrology and integrated metrology * Lithography and immersion lithography * Copper/low k integration and dieletrics * Vacuum technology * Etching * 300-mm wafer
- Materials, advanced packaging . . .
- Secondhand equipment market: maintenance, manufacturing & services * Opportunities and challenges
- EDA and IC manufacturing * IC assembly and design, R&D tools, and development trends * DFM
- Flat panel display technology and processing
- How to improve 90-mm production, the challenge of 65-mm production and other technologies
- IC circuit design and test design
- Yield management * Improve productivity
- Nanotechnology
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AGENDA (tentative) |
| September 18 |
Set up |
| September 19 |
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AM |
8:30 - 9:00 |
Registration |
| 9:00 - 9:10 |
Opening |
| 9:10 每 12:25 |
Main Presentation |
PM |
13:30 - 17:30 |
Main Presentation |
| 17:30 每 17:45 |
Lucky Draw |
| September 20 |
AM |
9: 00 每 12: 15 |
Special Report |
PM |
13: 30 每 17: 30 |
Special Report |
14:00 每 17:15
Workshop |
EDA & IC Manufacturing, DFM |
| 17: 30 每 17: 45 |
Lucky Draw |
| Sept 19 & 20 |
Exhibition activities |
Standard 3 x 3 sqm booth space with lighting, table and chairs |
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| Call for PaperㄩSubmitting articles are welcomed, suggested article length should be within 5000 Chinese words. Submitted articles should be sent in disk including a printed out copy, or e-mail to Irenel@actintl.com.hk CC:sunniez@actintl.com.hk . Please submit in Word file. Selected articles will be used in SST-AP China. Deadline: August 10, 2005. |
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