Biography for Alec J. BabiarzChip China -- 08/2005Alec J. Babiarz is Senior Vice President and a founder of Asymtek. Asymtek designs and manufactures dispensing equipment for printed circuit board assembly, advanced semiconductor packaging, flat panel display assembly and electrical component assembly. Alec is co-developer in 31 patents worldwide for fluid dispensing equipment and has written more than 15 papers on fluid dispensing and jetting. He received a BS in Engineering from Arizona State University, and Masters degrees from Stanford University in Mechanical Engineering and Electrical Engineering. Alec currently manages international sales and marketing at Asymtek. In addition, he serves as President of Nordson-Asymtek K.K., a division of the corporation in Japan. Beginning in 1983, Alec and the co-founders of Asymtek built the company from a very small operation into a leading manufacturer of dispensing equipment worldwide. Asymtek’s co-founders Robert L. Ciardella, Phil Maiorca, and Alec met as recent college graduates at their first “real” jobs at Hewlett-Packard (HP) in the early 1970’s, before the IBM PC and Apple computers. While at HP, they worked on the first thermal ink jet printers and helped bring the PC into the manufacturing and business environment.Inspired by the new high-tech trend in Silicon Valley, Alec, Bob and Phil created an idea on a bar napkin, after a ski trip in 1981. They never developed their original concept -- a magnetic ink printer, but they soon created an X-Y table and controller that were driven by a PC. (Using a PC as a manufacturing tool with specialized menu-driven software was almost unknown at that time.) Asymtek soon began riding the wave of electronics manufacturing, which started with the dispensing of temporary solder mask with an air-operated syringe in 1984. The wave continued to rise with flip chip underfill in the late 1990’s and now continues on today, with new jetting technologies and the latest techniques for manufacturing OLEDs.

Alec J. Babiarz个人简历Chip China -- 08/2005Alec J. Babiarz是Asymtek创始人之一，目前担任Asymtek公司资深副总裁。

Asymtek 专业设计并制造自动点胶系统，设备专门用于先进半导体封装、平板显示器装配，以及电子元器件装配。Alec是全球点胶设备方面31项专利的合作研发者，并撰写了15篇关于点胶和喷胶方面的论文。他在美国亚利桑那州州立大学获得工程学士学位，其后在美国斯坦福大学获得机电工程硕士学位。

Babiarz is Senior目前负责Asymtek的国际市场和营销。另外，他还兼任Nordson-Asymtek K.K（日本分部）总裁。1983年， Alec和其他合伙人一起创建了Asymtek公司，并将其发展成为世界范围内领先的点胶系统设备制造商。

Asymtek的合伙人Robert L. Ciardella, Phil Maiorca, 和 Alec 相识于七十年代初跨出校门后的第一份工作，当时是在惠普公司（HP），以后他们又在IBM 个人计算机公司公司和苹果计算机公司共事过。在惠普公司时，他们共同研发了第一代热敏喷墨打印机，并促使使个人计算机投入批量生产并商用。受到当时硅谷高科技浪潮的影响，1981年Alec, Bob and Phil在一次滑雪的短途旅行中在餐巾纸上写下他们的创意。但他们没有实现当初的设想－磁性喷墨打印机，而是发明了一种由个人计算机驱动的X-Y轴工作台及控制器。（而当时菜单式计算机控制方式的计算机能够用于生产还不为人所知）。1984年Asymtek很快赶上电子制造工业发展的浪潮。技术浪潮最早使用的是1984年用气动注射筒进行临时的焊料掩膜点胶，其后在90年代后期继续发展成倒装芯片底部填充，现在又出现了喷射点胶技术以及用于OLEDs制造的最新技术。

The Paradigm Shift in Applying Liquid Underfill for CSP, FCIP, and Stacked Die in Backend Assembly by Utilizing Adhesive Jetting Technology.

By: Alec J. Babiarz,
Asymtek, 2762 Loker Ave. West, Carlsbad, CA 92024 USA
ababiarz@asymtek.com

Abstract: The new “keep out” area design constraints for CSP packages, FCIP and stacked die packages which utilize flip chips or a combination flip chips and wire bonded die, have exceeded the capability of traditional needle dispensing of encapsulants and underfill epoxy. Jetting the liquid encapsulants for traditional flip chip underfilling provides smaller fillets and faster throughput which allows low cost manufacturing, thereby enabling an introduction of new package designs. In the circuit assembly process, jetting underfill adhesives has also provided significant improvements in manufacturing flip chip on flex for the disk drive industry. Jetting allows the fast application of pre-applied underfill to area array packages to reinforce the solder balls makes pre-applied adhesive an alternative to CSP underfilling. This paper will explore how jetting works, the theory of underfilling, and the large number of applications for this new technology in semiconductor packaging. The jetting process is an enabling technology for the semiconductor packaging engineer that breaks the traditional barriers in applying liquid adhesives.