Richard R. Chang, CEO, SMIC

Richard Chang received his B.S. degree in Mechanical Engineering from National Taiwan University in 1970, his M.S. degree in Engineering Science from State University of New York at Buffalo in 1974, and his Ph.D. degree in Electrical Engineering from Southern Methodist University in 1986. His Ph.D. dissertation was on the design of double hetrojunction AlGaAs semiconductor injection laser.

After working for Union Carbide Corp. (in Tonawanda, N.Y.) for a few years as a Process Development Engineer, Richard joined Texas Instruments Inc. (TI) in 1977 where he worked on a variety of projects for the next 20 years. He began as a Design Engineer in TI’s Specialty Product Division in Lubbock, Texas. Richard contributed to the development of the highly acclaimed speech learning toy called “Speak and Spell”. He also worked in TI’s Central Research Laboratories (CRL) on projects such as solar cell systems and infrared detectors for various applications. From 1983, he joined DMOS4’s (TI’s first 6” wafer fab in the States) start-up team and was responsible for program scheduling, budget planning, equipment selection and purchasing, technology transfer, and training of engineers and operators. In the late 80s, he joined the DRAM technology/operation fan-out team in TI’s MOS Memory organization, reporting to Dr. Fann Shao, from whom he learned and benefited tremendously. With the help of his team, Richard achieved the operation and business goals. Besides DMOS4, his involvement led to the construction and start-up of operations for the following wafer fabs of TI: TI-Acer Fab1A & 1B (both in Hsin-Chu, Taiwan), TECH Fab1 (in Singapore), AMOS Phase2 (in Italy), and KTI (a JV between Kobe Steel and TI, in Japan). His outstanding contributions were highly recognized by TI’s top management. Late 1997, as TI began to focus on DSP and Analog products, TI’s MOS Memory group was sold to Micron and Richard took early retirement from TI.

In October of 1997, Richard joined Worldwide Semiconductor Manufacturing Corp. (WSMC) and became its President in February of 1998. He prudently recruited and kept accountable the executive management team. With their collective efforts, the team completed the fab construction, equipment selection, technology transfer (from Toshiba and Fujitsu), technology development (of 0.35um to 0.20um logic, mixed-signal, DRAM, SRAM, and nonvolatile memory technologies), wafer and mask production, and sales/marketing operations. WSMC became profitable by the fourth quarter of 1999, and subsequently was merged with Taiwan Semiconductor Manufacturing Co. (TSMC) in January of 2000.

To materialize the vast market opportunities in China and to fulfill his long-term goal of raising the semiconductor technology level in China, Richard chose Shanghai as the site for starting up a new wafer foundry: Semiconductor Manufacturing International Corp. (SMIC).
l In February of 2000, Richard became the President and CEO of SMIC. Their team ramped up three fabs in Shanghai within the first two years.
l In 2002, its first year of full production, SMIC was ranked as the ninth-largest global foundry, with an estimated US$95 million in sales.
l In 2003, SMIC merged a foundry fab (MOS17) of Motorola in Tianjin.
l In 2004, a new 12-inch wafer fab commenced pilot production in Beijing. SMIC has successfully passed the strict requirements, officially listed on The Stock Exchange of Hong Kong (SEHK) and the New York Stock Exchange (NYSE) on Mar.17, 2004.
l Now SMIC is building other three fabs in Shanghai and a testing fab in Chengdu

SMIC- Semiconductor Manufacturing International (Shanghai) Corp.
中芯国际集成电路制造(上海)有限公司
主讲人张汝京博士Dr. Richard Ru-Gin Chang讲题与大纲

Event – “CHIP China 2005” Advanced Technology Conference,
Organizer: Solid State Technology《半导体科技》
Date: Monday, September 19, 2005

Topic – “如何提升90纳米产量和挑战65纳米及更远技术节点”
“How to elevate 90nm technology to mass production and effectively tackle 65nm and beyond technologies.”

Outline

1. 周密及完整的技术研发规划
Comprehensive and complete technology development planning
根据客户需求及市场走向,选择适当研发工具及产品,筹组坚强研发团队,和工厂密切合作, 以期最短时间完成技术开发并走向量产
Select and apply the most appropriate process development tools and products based on customers’ needs and market trend, organize and build a strong development team, work closely with the Fab, in order to migrate to mass production as swiftly as possible

2. 审慎添购先进(精密)仪表及工艺设备,以如何在最短期间达到经济成果为主要考量
Carefully select and purchase the most advanced (precision) instruments and equipments, while achieving the best ROI (Return on Investment) in the shortest time

3. 严谨控制制程及产品的验证过程以保证最佳生产品质
Exercise utmost control during the process and product qualification in order to ensure best manufacturing quality

4. 提升成品率以达世界一流水平
Enhancement of wafer yielding capability to world- class level
研发和产品部门设定提高成品率时间表及里程碑,同时提高成品率
Establish a schedule and milestone for yield enhancement with both R&D and product departments to jointly find the optimal path to further improve the yield


5. 专注关键技术及量产相关流程的控制
Focus on the control of critical process and mass production related flows

6. 维持生产制造效率及稳定性
Maintain efficiency and stability during mass production

7. 中芯国际90纳米产品从研发到量产的实际历程及经验
SMIC’s experience in developing 90nm technology to mass production

8. 65纳米及更远技术节点发展策略
Strategy on the development of 65nm (and beyond) technologies