晶芯 2005 - 先进技术研讨会 会议议程
Chip China 2005 – Advanced Technology Conference Agenda

9月19日 (上午08:00 - 登记)
Sep 19 (08:00 a.m. - Registration)
内容 Content 演讲者Speaker 演讲公司 Company
会议开幕词
Opening address
麦协林- 社长
Adonis Mak- Publisher
半导体科技杂志
SST-AP-NMD China Magazine
提高自主创新能力推动半导体产业发展
Enhance self-creativity, contribute to the development of Semiconductor Industry
徐小田- 秘书长
Xiaotian, Xu- Secretary
中国半导体行业协会
China Semiconductor Industry Association
上海集成电路产业发展现状
Shanghai Semiconductor Industry
蒋守雷- 秘书长
Shoulei, Jiang- Secretary General
上海集成电路协会Shanghai Integrated Circuit Industry Association
全球 IC 设计链制胜战略
Winning Strategy in the Global IC Design Chain
居龙 - 全球副总裁兼亚太区总裁
Lung Chu - President of Asia Pacific Field Operations
Cadence
中国半导体设备的机遇
China Semiconductor equipment opportunity
陈捷 – 总裁
Jay Chen - President & COO
东电电子
TEL
后摩尔定律—半导体技术后继创新探讨
Post Moore's Law – Semiconductor Technology Development
许居衍 – 中国工程院院士及五十八所名誉所长
Ju Yan, Xu – Member/Honorary Director
中国工程院/ 五十八所
Chinese Academy of Engineering/ China Electronics Technology Group Corp-The 58th Research Institute
午餐 Lunch
铜和低介电常数材料互连技术的挑战
Challenges in Cu/Low k interconnects
刘钧 - 技术总监
James Liu - Sr. Technologist
诺发系统
Novellus
从微电子到纳米电子的挑战和出路
Challenges and Solution When We go from Microelectronic to Nanoelectronic
高腾 – 亚洲部经理
Teng, Gao – Asia Liaison Manager
IMEC
积极参与中国IC产业的发展 李伟 – 总经理
William Lee -GM
捷智半导体
Jazz Semiconductor
Exploring Emerging Reliability Concerns for Advanced CMOS Technologies 赵月刚 – 首席高级应用工程师Yuegang, Zhao- Lead Applications Engineer Keithley Instruments Inc. – Semiconductor Business Group
如何提升90纳米产量和挑战65纳米及更远技术节点
How to elevate 90nm technology to mass production and effectively tackle 65nm and beyond technologies
张汝京- 总裁
Richard Chang
– President & CEO
中芯国际
SMIC
IC技术的现状及发展趋势
IC Technology Status and Development Trends
马佐平-微电子研究中心共同主任/美国国家工程院院士
Zuo pin Ma
美国耶鲁大学
Yale University
提问时段 Q & A session
抽奖 Lucky Draw

9月20日 (上午08:00 - 登记)
Sep 20 (08:00 a.m. - Registration)
内容 Content 演讲者Speaker 演讲公司 Company
集成电路制造中的检测和控制
Process Diagnose and Control in IC manufacturing
肖思群 – PDC 总经理
Siqun, Xiao- PDC General Manager
应用材料
Applied Materials China
光刻技术在65纳米及更远技术节点的挑战
Challenges of Advanced Lithography for 65nm and Below
Jo Finders – Imaging System Development Specialist ASML
The Paradigm Shift in Applying Liquid Underfill for CSP, FCIP, and Stacked Die in Backend Assembly by Utilizing Adhesive Jetting Technology Alec J. Babiarz - Senior VP ASYMTEK
Solid-State Laser Micro-machining in Electronics Manufacturing Mingwei LiApplications Engineering Manager Newport
午餐 Lunch
Semiconductor Industry in Transition,Technology Challenges and the Future of Chip-making David Barach
– Group Publisher
SolidState Technology Magazine
应用于各种光学及其他传感器应用的、使用接触硅的全新晶圆级封装技术 Gautham Viswanadam– R&D Manager 肖特电子有限公司
Schott Advanced Packaging Singapore Pte Ltd
提问时段 Q & A session

圆桌论坛 Panel Discussion
题目Topics

1、 半导体产业发展与3C产品(从电子消费产品、通讯产品、电脑相关产品的市场供、需关系及产品设计开发方面讨论,分析国、内外的半导体产业发展走向)

The development of the Semiconductor Industry and the impact of 3C productsIn the past, the military then the computer industry were the largest users of semiconductors. Today, however, it is manufacturers of consumer products who are the largest users. However, their requirements on semiconductor companies are different from those made by the computer industry. Consequently, semiconductor companies must change to meet these new requirements. One change may be having to accept lower profit margins. Other changes will be needed as well.

2、 设计公司如何快速实现设计业设计产品化、市场化,达到芯片规模化生产?如何应对产品的快速创新与有替换?

How does an IC design house grow from being an engineering organization to a semiconductor company? That is, how does a IC design house quickly achieve a product-oriented, market-oriented outlook, and then move into volume production of chips.

3、 面对半导体企业逐渐缩小的利润空间,如何结合产品需求而更加完善成熟工艺?是继续纵向深亚微米的技术挑战还是横向拓展产品应用,以平衡企业在技术研发的高额投资?

In a market facing reduced profit margins, what factors should a semiconductor company consider when budgeting its high expenditures in R&D: Should more money be spent on developing additional products or developing additional expertise in chip manufacturing.

圆桌论坛主持人:赵建忠,上海市集成电路行业协会常务秘书长
圆桌论坛成员Panelists
陈平-业务总监,台积电;王克扬-市场部副总经理,东电电子; 李建文-数字集成电路研发部总监,Cadence;卢斌-高级副总裁,展讯通信;胡志群-大中华区工程技术服务部总经理,IBM;张南平-副总经理,上海华虹集成电路
Peter Chen–Director Business Development,TSMC;Justin Wang – VP, Asia Pacific, TEL; Jian Wen Li, Cadence;Bing Lu-VP,SPREADTRUM;Chih Chum Hu-General Manager GCG Operations ,IBM;Nan Ping Zhang-VP,Shanghai Huahong Integrated Circuit;

抽奖 Lucky Draw
招待酒会(凭酒会出席券)SSTC and CRC


备注 Remark
此议程有可能更改, 如有任何变动以现场公布为准, 组委会保留修改权利.
This agenda may be altered, please refer to the on-site notice, the committee reserves the right to modify.
演讲中段将设茶歇.
There will be Tea Breaks at intervals